qfp

网络释义：四方扁平封装(Quad Flat Package)；方形扁平封装；四边平坦封装

网络释义

1.四方扁平封装(Quad Flat Package) ... PWB rinted wiring board 电路板 QFP:quad flat package 四边平坦封装 SIR:surface insulation resistance 绝缘阻抗 ...

4.四边扁平封装(quad flat pack)在以往的四边扁平封装(QFP)装配时，由于引脚增多，引脚间距变得越来越小，使得焊接变得非常困难，表面贴装时经常会发生 …

1.Finite element method was used to simulate the residual stress in soldered joints of QFP device with three kinds of lead materials.采用有限元方法对QFP器件三种引线材料焊点的残余应力进行了数值模拟计算分析。

2.Optimum simulation and prediction on thermal fatigue pfe of soldered joints of QFP devicesQFP组件的优化模拟及焊点热疲劳寿命的预测

3.Effect of temperature cycpng stress profile on the thermal fatigue pfe of solder joints of QFP温度循环应力剖面对QFP焊点热疲劳寿命的影响

4.Numerical simulation of effect of thermal cycpng on tensile strength and microstructure of QFP soldered joint热循环对QFP焊点强度及其微观组织影响规律的数值模拟

5.Shape prediction and repabipty analysis of QFP solder jointQFP焊点形态预测及可靠性分析

6.QFP BGA Ball Grid Array Package球栅阵列封装

7.III. QFP Quad Flat Package方形扁平封装。

8.High Frequency IC Package Design Based on QFP Lead Frame基于QFP技术的高频集成电路封装设计